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MB39A114 LTM4649 C2012 A78R12 13001 GKFKG 3194B 13001
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  advanced power p-channel enhancement mode electronics corp. power mosfet     lower on-resistance bv dss -40v     simple drive requirement r ds(on) 50m      fast switching characteristic i d -22a description absolute maximum ratings symbol units v ds v v gs v i d @t c =25  a i d @t c =100  a i dm a p d @t c =25  w w/  t stg  t j  symbol value units rthj-c thermal resistance junction-case max. 3.6  /w rthj-a thermal resistance junction-ambient max. 110  /w data and specifications subject to change without notice 201229041 ap9567gh/j rating -40 25 -22 0.28 pb free plating product continuous drain current, v gs @ 10v -14 pulsed drain current 1 -50 thermal data parameter total power dissipation operating junction temperature range storage temperature range -55 to 150 linear derating factor 34.7 -55 to 150 parameter drain-source voltage gate-source voltage continuous drain current, v gs @ 10v g d s g d s to-252(h) g d s to-251(j) the to-252 package is universally preferred for all commercial- industrial surface mount applications and suited for low voltage applications such as dc/dc converters. the through-hole version (AP9567GJ) is available for low-profile applications.
ap9567gh/j electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =-250ua -40 - - v  b v dss /  t j breakdown voltage temperature coefficient reference to 25  , i d =-1ma - -0.03 - v/  r ds(on) static drain-source on-resistance 2 v gs =-10v, i d =-15a - - 50 m  v gs =-4.5v, i d =-8a - - 70 m  v gs(th) gate threshold voltage v ds =v gs , i d =-250ua -1 - -3 v g fs forward transconductance v ds =-10v, i d =-15a - 12 - s i dss drain-source leakage current (t j =25 o c) v ds =-40v, v gs =0v - - -1 ua drain-source leakage current (t j =150 o c) v ds =-32v, v gs =0v - - -25 ua i gss gate-source leakage v gs = 25v - - na q g total gate charge 2 i d =-15a - 11 18 nc q gs gate-source charge v ds =-32v - 3 - nc q gd gate-drain ("miller") charge v gs =-4.5v - 6 - nc t d(on) turn-on delay time 2 v ds =-20v - 10 - ns t r rise time i d =-15a - 43 - ns t d(off) turn-off delay time r g =3.3  , v gs =-10v - 24 - ns t f fall time r d =1.3  -45- ns c iss input capacitance v gs =0v - 880 1400 pf c oss output capacitance v ds =-25v - 140 - pf c rss reverse transfer capacitance f=1.0mhz - 110 - pf r g gate resistance f=1.0mhz - 5 8  source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =-15a, v gs =0v - - -1.2 v t rr reverse recovery time 2 i s =-15a, v gs =0v, - 30 - ns q rr reverse recovery charge di/dt=-100a/s - 24 - nc notes: 1.pulse width limited by safe operating area. 2.pulse width < 300us , duty cycle < 2%. 100
ap9567gh/j fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fig 5. forward characteristic of fig 6. gate threshold voltage v.s. reverse diode junction temperature 0 10 20 30 40 50 02468 -v ds , drain-to-source voltage (v) -i d , drain current (a) t c =25 o c v g = -3.0 v -10v -7.0v -5.0v -4.5v 35 45 55 65 75 246810 -v gs , gate-to-source voltage (v) r ds(on) (m     ) i d =-8a t c =25     0.6 0.9 1.2 1.5 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d =-15a v g =-10v 0.4 0.8 1.2 1.6 -50 0 50 100 150 t j , junction temperature ( o c) normalized -v gs(th) (v) 0 2 4 6 8 10 0 0.2 0.4 0.6 0.8 1 1.2 1.4 -v sd , source-to-drain voltage (v) -i s (a) t j =25 o c t j =150 o c 0 10 20 30 40 50 02468 -v ds , drain-to-source voltage (v) -i d , drain current (a) t c = 150 o c -10v -7.0v -5.0v -4.5v v g = -3.0 v
ap9567gh/j fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. transfer characteristics fig 12. gate charge waveform q v g -4.5v q gs q gd q g charge 0 2 4 6 8 10 12 0 5 10 15 20 25 q g , total gate charge (nc) -v gs , gate to source voltage (v) v ds =-32v i d =-15a 100 1000 10000 1 5 9 1317212529 -v ds , drain-to-source voltage (v) c (pf) f =1.0mhz c iss c oss c rss 0 10 20 30 40 02468 -v gs , gate-to-source voltage (v) -i d , drain current (a) t j =150 o c t j =25 o c v ds =-5v 0.01 0.1 1 0.00001 0.0001 0.001 0.01 0.1 1 t , pulse width (s) normalized thermal response (r thjc ) p dm duty factor = t/t peak t j = p dm x r thjc + t c t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse 0.01 0.1 1 10 100 0.1 1 10 100 1000 -v ds , drain-to-source voltage (v) -i d (a) t c =25 o c single pulse 100us 1ms 10ms 100ms 1s dc


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